FPGA and electronics
I am interested in FPGAs (both the logic synthesis / place and route side of things and actually using them for stuff like communications and DSP).
Specific projects I am working on (in various stages of non-completion) include:
GSM RF frontend, baseband (digital frontend, synchronization, channel estimation, channel shortening filter, equalizer, channel coding decoder, etc), transmitter, and accompanying channel simulator
1090ES/Mode-S/ADS-B aircraft transponder (RF frontend, baseband, interrogation processor, transmitter, interface to aircraft systems)
Angle-of-arrival / time-difference-of-arrival / frequency-difference-of-arrival system for rapidly locating emitters of narrowband digital and analog voice VHF/UHF signals
Miscellaneous Other Hardware (but not electronics) Stuff That I Don’t Yet Have The Equipment And Space For
I read a paper about the use of pumped two-phase cooling 1 for thermal management of power electronics and microprocessors and was really intrigued. In fact, I was so intrigued, I read some more papers about two-phase cold plates, learned about critical heat flux and flow instabilities, and I’ve been sketching out a design for a cold plate that would be fabricable without the use of a vacuum brazing furnace and with only modest cost for the machining operations. Naturally, I do not expect to push the envelope in terms of critical heat flux or heat transfer coefficient; and my goal is modest and possibly even achievable: no failure of brazed joints. If I can get heat transfer commensurate with a single-phase water cooling system that’d be even better. I’ve always wanted to learn CAD and machining and while I don’t expect to actually machine the parts myself (I will use a service for the machining) I will be designing them and assembling/brazing/testing them. I’m also looking into the use of a low-temperature copper/silver sintering paste/powder to create a boiling-enhancement coating, by modifying process parameters to intentionally create a significant amount of voiding/porosity.
Two-phase cooling is not vapor-compression refrigeration. There is no compressor involved in two-phase cooling and it may even be accomplished with passive transport of the fluid, as in two-phase thermosyphons or heatpipes.↩︎